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Quality Warranty

Quality Management System Certification

Quality Management System Certification is registered byISO9001:2008.All products in the office and the distribution center are ofglobal approval and meet the demand of the distributor of space flight aviationand the national defence of the Quality Management System Certification.
Having registration demonstrates to our customers that topmanagement is committed to providing customers with original components withthe least risk of counterfeit.

Policy on Environment

YIC has been attaching importance to the environmentalprotection so as to prevent pollution from appearing and satisfy the need forsupervision and environmental protection. We will join hands with ourCustomers,Suppliers as well as the Community in order to know more about theenvironmental problem and support the work of optimizing the cooperativepartnership, reducing the trade impact on environment as much as possible.

Statement of YIC

It is claimed by YIC that all products sold are 100% authentic.Each product has been tested carefully before being sent to the customer. It isour aim to be responsible for our customers and make them satisfactory.

Quality Policy

YIC is committed to gratifying and astonishing customers withour customer service excellence, order accuracy and on-time delivery. This isaccomplished through our commitment to continual improvement of our processes,services, products.

Testinglab support

YIC will ensure all the functions are no problems before theshipment. All parts will part our QC Dep., we can supply profession testingtechnology. Include functions testing, Visual inspection, X-Ray inspections,Solderability Testing and Acetone erase check. Guarantee all components are noproblems with the least risk to customer.
Please send your questions about quality or request forCorrective Actions to Quality. Any questions about our Quality ManagementSystem feel free to contact us. Email: Info@YIC-Electronics.com


All functions and parameters tested, referred to asfull-function test, according to the original specifications, applicationnotes, or client application site, the full functionality of the devicestested, including DC parameters of the test, but does not include AC parameterfeature analysis and verification part of the non-bulk test the limits ofparameters.


Use of stereoscopic microscope, the appearance of components for360 ° all-round observation. The focus of observation status include productpackaging; chip type, date, batch; printing and packaging state; pinarrangement, coplanar with the plating of the case and so on.
Visual inspection can quickly understand the requirement to meetthe external requirements of the original brand manufacturers, anti-static andmoisture standards, and whether used or refurbished.


X-ray inspection, the traversal of the components within the 360° all-round observation, to determine the internal structure of componentsunder test and package connection status, you can see a large number of samplesunder test are the same, or a mixture (Mixed-Up ) the problems arise; inaddition they have with the specifications (Datasheet) each other than tounderstand the correctness of the sample under test. Connection status of thetest package, to learn about the chip and package connectivity between pins isnormal, to exclude the key and open-wire short-circuited.
Acetone erase check
Private key of the device surface for printing text and iconsreagent acetone wipe and re-marking inferior ink can easily be erased.
Visual Inspection X-Ray Analysis Decapsulation Analysis Spectrometer Dimension Verification