Infineon and CEVA collaborate to improve the voice user interface of connected devices

  From smart speakers to smart TVs, conferencing systems or smart home appliances, voice recognition makes the operation of electronic devices easier and more intuitive. As a result, the demand for voice user interface (VUI) in electronic devices has increased dramatically. It is estimated that the average annual growth rate of the smart speaker market alone will be as high as 20%.

High-quality MEMS microphones and leading audio processing capabilities are key factors that make voice control devices truly adaptable to everyday environments. To drive the development of voice control devices and integrate them into a wide range of devices, Infineon has launched the VUI Partner ecosystem. With its technological advantages, Infineon and its partners will provide innovative reference platforms and ready-to-use next-generation voice user interface solutions. Currently available solutions come from companies such as Aaware, CEVA, Creoir, SoundAI, Sugr and XMOS.

Oliver Henning, head of co-management management at Infineon's Power Management and Diversified Markets Division, said: "Whether in a noisy environment or in a low voice command, voice recognition can be reliably operated. A key feature of connected devices. Infineon's VUI partner ecosystem is dedicated to quickly and easily integrate high-performance VUI functionality into smart devices and applications. Infineon and our partners will provide system reference designs And engineering and design capabilities to help our clients successfully complete projects."

XENSIVTM MEMS microphone breaks through the audio chain limit

Early voice user interfaces focused on voice input and response to these core features. With the iterative update of voice user technology and the ever-increasing user expectations, these features are no longer sufficient. For example, the user wants the device to accurately understand its instructions even when whispering or converting rooms.

Infineon's XENSIVTM MEMS microphone introduces a new performance benchmark and breaks the current audio chain limitations. The IM69D130 is designed for applications that require low self-noise (high SNR), wide dynamic range, low distortion, and high acoustic overload points. The solution supports far-field and flexible audio signal pickup for precise control of the sound beam and covers other advanced audio algorithms that are increasingly used in VUI applications. In addition, different power modes can be selected to suit specific current consumption requirements, such as battery-powered speakers.