HCC22HETS

FAQFrequently Asked Questions

• What are the key differences between the HCC22HETS and standard dual-row edge connectors, and how do I determine if the HCC22HETS is suitable for my card-edge application? The HCC22HETS is a 22-position single-row female edge connector with 0.100" (2.54mm) pitch and a 0.062" (1.57mm) card thickness specification. Unlike dual-row connectors, the HCC22HETS accommodates single-row PCB edge layouts, making it suitable for legacy or space-constrained designs. The single read-out configuration means the connector engages the card from one direction only. Verify your PCB edge has exactly 22 gold contact pads at 0.100" spacing and 0.062" thickness before selecting the HCC22HETS; mismatches in card thickness or pitch will result in poor contact or mechanical damage.
• Can I use the HCC22HETS as a direct replacement for older Samtec or Amphenol 22-position edge connectors in my existing design? Replacement compatibility depends on three factors: pitch (0.100" for HCC22HETS), card thickness (0.062" ±tolerance), and contact geometry. The HCC22HETS cantilever contact type and beryllium copper material with 30µin gold plating are typical for standard edge connectors. However, verify the original connector's exact card thickness specification and contact pressure before substitution; some legacy designs use 0.050" or 0.070" card thickness, which will not seat properly in the HCC22HETS. Cross-reference the original part number's datasheet to confirm mechanical compatibility. If the original connector uses a different contact material or finish thickness, test insertion force and contact resistance on a sample before full production switch.
• What soldering challenges should I anticipate when designing PCB layout for the HCC22HETS, and are there specific thermal or mechanical considerations for the solder-mount termination? The HCC22HETS uses through-hole solder termination, which requires careful PCB layout to manage thermal stress during reflow. With 22 solder joints in close proximity (0.100" pitch), ensure adequate via spacing beneath the connector body to minimize solder bridge formation and allow solder wicking. The beryllium copper contact material has different thermal expansion characteristics than standard phosphor bronze; design the connector footprint with ±0.010" tolerance on pad placement to accommodate manufacturing variation. During reflow, use a thermal profile that avoids rapid temperature cycling; beryllium copper is more sensitive to thermal cycling fatigue at the solder joint than standard materials. For through-hole mounting, consider wave-soldering or selective reflow instead of full-board IR reflow to reduce thermal shock. Perform thermal cycling tests (-65°C to +125°C, the operating range of the HCC22HETS) on pilot boards to verify solder joint reliability before production release.
• The HCC22HETS datasheet lists MSL 1 (Unlimited). What does this mean for my supply chain and storage procedures? Moisture Sensitivity Level 1 (MSL 1 Unlimited) on the HCC22HETS indicates the connector is not sensitive to moisture absorption during storage and requires no special dry-pack or bake-out procedures before soldering. This is typical for edge connectors with plastic insulation (the HCC22HETS uses polybutylene terephthalate / PBT). You can store the HCC22HETS under normal warehouse conditions without humidity control or desiccant packs. This simplifies inventory management compared to moisture-sensitive components (MSL 3–6) and reduces the risk of solder joint voids caused by outgassing during reflow. However, verify connector cleanliness before soldering; any residual PCB contaminants or flux residue can still degrade contact resistance over time.
• How do I verify contact reliability and resistance for the HCC22HETS in a high-reliability or long-term industrial application? Contact reliability for the HCC22HETS depends on insertion cycles, environmental stress, and electrical load. The gold-plated beryllium copper contacts are rated for moderate insertion cycles (typically 50–100 cycles for edge connectors), so avoid designs requiring frequent card removal. For industrial applications, measure contact resistance at board level after initial assembly; a typical range for HCC22HETS is 10–50 mΩ per contact when properly seated. Perform thermal cycling tests across the full operating range (-65°C to +125°C) while monitoring contact resistance; any increase >100 mΩ after cycling indicates potential solder joint cracking or contact fretting. In high-vibration environments, the cantilever contact design of the HCC22HETS may experience micro-motion if the card is not mechanically constrained; add mechanical guides or retention clips to prevent relative motion between the card and connector body. For mission-critical applications, conduct salt-fog or humidity-bias testing to assess long-term degradation of the 30µin gold finish on the HCC22HETS contacts.
• What are the electrical performance limits of the HCC22HETS, and will it support high-speed digital signals or power delivery on all 22 positions? The HCC22HETS is a general-purpose edge connector without specification for high-speed signal integrity or impedance control. With 0.100" pitch and no internal ground plane or shield definition, the HCC22HETS is suitable for legacy digital signals (typically <10 MHz clock rates) and low-current power distribution. Do not use all 22 positions for power delivery on the HCC22HETS; beryllium copper conductors have higher resistance than silver-plated copper, and solder joints add thermal resistance. For power applications, derate current per position to approximately 1–2 A depending on ambient temperature and board cooling; a full load of 44 A (22 positions × 2 A) across the HCC22HETS will generate localized heating near the solder joints and increase contact resistance due to thermal expansion mismatch. For high-speed signals (>50 MHz), the HCC22HETS introduces crosstalk due to lack of ground shielding between adjacent contacts; use differential pairs with dedicated ground contacts if signal integrity is critical. If mixed-signal operation is required, physically separate power and signal contacts on the card edge to minimize coupling.
• Is the HCC22HETS rated for direct -65°C to +125°C operation, and what precautions are needed for thermal cycling or shock? The HCC22HETS is rated for continuous operation across -65°C to +125°C, but this does not guarantee unlimited thermal cycling without performance degradation. Beryllium copper and PBT insulation have different coefficients of thermal expansion; repeated cycling induces mechanical stress at the solder joint interface. The 30µin gold finish on the HCC22HETS contacts provides corrosion resistance but is thin enough that accelerated thermal cycling (>100 cycles) may cause micro-cracking, exposing the underlying beryllium copper and increasing contact resistance. For applications requiring frequent thermal extremes (e.g., outdoor or aerospace), design the PCB with strain relief around the HCC22HETS footprint using flexible traces or a stepped PCB thickness. Additionally, ensure the card retention mechanism allows for thermal expansion of the card relative to the connector body; over-constraining the card during cold cycles will increase mechanical stress on the HCC22HETS contacts. Perform accelerated thermal cycling validation (IPC-A-610 or equivalent) before deployment in temperature-cycling environments.
• Can I use the HCC22HETS in a design where the card will be inserted and removed multiple times, and what is the expected connector life in cycle testing? The HCC22HETS cantilever contact design supports moderate insertion-removal cycles, but the actual cycle life depends on contact wiping and mechanical wear. Standard edge connectors with gold plating (including the HCC22HETS) typically survive 50–100 insertion-removal cycles before contact resistance begins to degrade. After ~50 cycles, the 30µin gold finish on the HCC22HETS may show localized wear, and the underlying beryllium copper becomes exposed. This accelerates oxidation and increases contact resistance, particularly in humid or corrosive environments. If your application requires >100 cycles, design the card edge with a smooth, beveled entry edge to minimize contact scraping, and consider applying a thin protective coating (e.g., nickel-PTFE) over the card edge pads to reduce wear. Alternatively, evaluate higher-cycle-rated connectors (e.g., 500+ cycle edge connectors with thicker gold plating). For applications with frequent insertion, perform cycle life testing on the HCC22HETS with your specific card edge geometry to establish a reliable operational cycle limit.
• What is the difference between the HCC22HETS and the HCC22 base product number, and should I order by base number or full part number? The HCC22 is the base product series for 22-position edge connectors from Sullins, and HCC22HETS is a specific configuration within that series. The 'HETS' suffix indicates the HCC22HETS has specific attributes: female gender, through-hole solder termination, and the side-mount opening flange. When ordering, always specify the full part number HCC22HETS to ensure correct gender, termination type, and mounting features; ordering by base number HCC22 alone may result in male or surface-mount variants. Verify the distributor stock listing matches the full HCC22HETS part number and includes the mechanical drawing confirming 0.062" card thickness and 0.100" pitch.
• How do I test the HCC22HETS for proper seating and electrical continuity after assembly, and what acceptance criteria should I use? After soldering the HCC22HETS to the backplane PCB, perform a visual inspection to confirm all 22 solder joints are shiny, cone-shaped, and free of bridges or voids. Insert the card edge fully into the HCC22HETS and verify the card is flush with the connector body; any gaps indicate improper seating or card thickness mismatch. Measure electrical continuity with a multimeter on each contact pair (card pad to solder joint) at low ohms; acceptance criteria for the HCC22HETS is typically <100 mΩ per contact path. For automated testing, use bed-of-nails or flying-probe equipment to measure resistance on all 22 positions simultaneously; log data to establish a baseline for in-service diagnostics. Perform a pull-force test on the assembled card to confirm mechanical retention; the card should require 5–15 lbf (22–67 N) of force to remove, depending on the HCC22HETS flange design and retention clip configuration. If a contact measures >200 mΩ or shows intermittent continuity, remove and re-solder the affected solder joint or replace the HCC22HETS connector before release to production.
• The HCC22HETS has a side-mount opening flange. What does this mean for PCB layout and mechanical assembly? The side-mount opening flange (0.125" / 3.18mm diameter, unthreaded) on the HCC22HETS is designed to align and guide the card edge into the connector. This flange is typically mounted flush with the top surface of the backplane PCB, allowing the card to slide in horizontally without lateral misalignment. The unthreaded opening means the flange is press-fit or soldered directly to the PCB; do not attempt to use fasteners through the opening, as this will damage the connector. In the PCB layout, provide a clearance hole or slot at the location of the HCC22HETS flange to prevent solder coverage; solder on the flange surface will interfere with card insertion. Additionally, ensure the backplane has adequate edge clearance around the flange opening to allow unobstructed card movement. The side-mount flange also serves as a secondary mechanical stop; design the card edge geometry (length and thickness) to seat fully against this flange, providing mechanical restraint without relying solely on friction.
• Is the HCC22HETS compliant with RoHS3 and REACH regulations, and do I need to perform any special documentation for export or procurement? The HCC22HETS is RoHS3 compliant and REACH unaffected, as stated in the component specifications. RoHS3 compliance means the HCC22HETS does not contain restricted substances (lead, cadmium, hexavalent chromium, or brominated flame retardants) above the specified thresholds. The beryllium copper contact material and PBT insulation meet these restrictions. REACH unaffected status indicates the HCC22HETS is not subject to REACH authorization or restriction articles, simplifying procurement and supply chain documentation. However, verify that your distributor provides a valid RoHS3 and REACH compliance certificate with your order; this documentation is required for final product certification if your application falls under regulatory scope (e.g., consumer electronics, medical devices). The ECCN classification (EAR99) and HTSUS code (8536.69.4040) indicate standard commercial export classification with no specific licensing requirements for most destinations. Check local export regulations if shipping the HCC22HETS to restricted countries.
• What environmental or reliability testing has Sullins performed on the HCC22HETS, and where can I find certification data for mission-critical applications? Sullins typically tests edge connectors like the HCC22HETS for basic mechanical and electrical performance per industry standards (e.g., IEC 61076, Underwriters Laboratories UL 1877), but specific certification data for the HCC22HETS is not detailed in the standard datasheet. For mission-critical applications (aerospace, medical, automotive), request from Sullins a detailed test report covering thermal cycling, vibration, salt-fog, and contact resistance measurements. Additionally, request historical failure data or reliability predictions (MTBF) if available. Many Sullins distributors or authorized partners can provide certificates of compliance and test data upon request. For applications requiring MIL-grade testing, verify that the HCC22HETS meets the specific MIL-C or MIL-DTL standard required (e.g., MIL-DTL-20995 for edge connectors); some military specifications may require higher gold plating thickness or additional environmental cycling beyond the HCC22HETS standard performance envelope.
• If I need a higher-cycle or more robust edge connector than the HCC22HETS, what alternative part numbers or manufacturers should I evaluate? If the HCC22HETS cycle life (50–100 insertions) is insufficient, consider higher-performance alternatives: Molex MicroCross (500+ cycle rating with thicker gold), TE Connectivity AMP MTA Flat Cable (automotive-grade connectors), or Phoenix Contact edge connectors (industrial-rated for 300+ cycles). These alternatives typically offer thicker gold plating (50–100 µin vs. 30 µin on the HCC22HETS), higher contact pressure, or enhanced materials (e.g., selective hard gold over nickel). However, these connectors may have different pitch (0.050" or 0.200"), card thickness requirements, or footprint dimensions, requiring PCB redesign. If cycle life is the only concern and PCB redesign is not acceptable, specify a protective coating or contact lubricant on the HCC22HETS card edge pads to extend life by 50–100 additional cycles. Perform side-by-side testing (mechanical wear, contact resistance after cycling) with candidate alternatives on your specific card geometry before committing to a replacement part number.
• Can beryllium copper contacts on the HCC22HETS pose a health or safety risk during soldering or assembly, and are special handling procedures required? Beryllium copper is classified as a beryllium-containing material, and inhalation of beryllium dust poses occupational health risks (chronic beryllium disease). However, the solid beryllium copper contacts on the HCC22HETS present minimal risk during normal soldering or assembly operations because they are not heated to vaporization or abraded to generate fine dust particles. Standard industrial hygiene practices (adequate ventilation, no dry-sanding or grinding of the connector) are sufficient. If the HCC22HETS contact is damaged or requires trimming or reworking, avoid grinding or dry-sanding; use wet methods or consult your occupational health and safety department for guidance. For disposal, treat the HCC22HETS as an electronic component and follow local e-waste regulations; do not incinerate or mechanically destroy the connector. Document the beryllium copper content in your material safety documentation if your product is subject to OSHA or EPA reporting requirements. Most distributors and manufacturers (including Sullins) provide material safety data sheets (MSDS) for beryllium-containing connectors; request the MSDS for HCC22HETS to confirm handling procedures with your assembly facility.
• What are the contact pressure and insertion force specifications for the HCC22HETS, and how do these affect card alignment and wear? The HCC22HETS datasheet does not explicitly state contact pressure (in grams-force) or insertion force, but typical cantilever-design edge connectors with similar dimensions operate at 50–150 grams-force per contact. This moderate contact pressure balances wiping action (which cleans oxidation from the 30µin gold surface) against mechanical wear and card insertion difficulty. Higher contact pressure increases initial contact resistance and extends cycle life but makes the card harder to insert. Lower contact pressure reduces insertion force but accelerates wear of the 30µin gold finish on the HCC22HETS, increasing the risk of oxide formation and contact resistance growth over time. If your card requires a specific insertion force (e.g., to meet keyboard or edge-card assembly standards), compare the HCC22HETS contact pressure to your force budget; a fully loaded 22-position connector may require 15–30 lbf (67–133 N) total insertion force. Perform insertion force testing on a pilot assembly to confirm compatibility with your card guidance mechanism. If contact wear becomes an issue during life-cycle testing, consider applying a thin nickel or nickel-PTFE plating over the card edge pads to reduce friction and extend contact life.
• Are there any known compatibility issues between the HCC22HETS and specific PCB materials or solder mask designs that could affect reliability? The HCC22HETS through-hole solder termination is compatible with standard FR-4 and high-Tg PCB materials (up to 170°C Tg). However, solder mask design can impact HCC22HETS reliability: if solder mask is applied too close to the through-hole pads (within 0.010" / 0.25mm), the mask may reflow or crack during soldering, creating solder bridges or voids beneath the HCC22HETS connector. Specify solder mask clearance at least 0.015" (0.4mm) away from the HCC22HETS pad edges. Additionally, avoid solder mask between through-holes on closely-spaced connectors; the 0.100" pitch of the HCC22HETS may leave insufficient space for solder mask between adjacent pins, increasing the risk of solder bridges. Use an IPC-A-610 compliant PCB design guide when laying out the HCC22HETS footprint to ensure proper spacing, clearances, and copper weight. If the HCC22HETS is mounted in a high-vibration or thermal-cycling environment, the PBT insulation material can absorb moisture under high humidity; specify the PCB surface finish (e.g., ENIG, OSP) to minimize moisture-induced corrosion at the HCC22HETS solder interface.
• What is the actual current-carrying capacity per contact on the HCC22HETS, and how does temperature affect this rating? The HCC22HETS datasheet does not specify a per-contact current rating, which is typical for edge connectors designed for low to moderate current and signal-only applications. Based on the beryllium copper contact size and 30µin gold plating, typical edge connectors with similar dimensions are rated for 1–3 A per contact at 20°C ambient. However, at the maximum operating temperature of the HCC22HETS (125°C), the current capacity must be derated by 20–30%, reducing the allowable current to approximately 0.7–2.4 A per contact. The solder joints connecting the HCC22HETS to the PCB have even lower current capacity (typically 2–5 A per joint before thermal failure), so the solder connection, not the contact itself, may be the limiting factor. For high-current applications (>10 W across the 22-position connector), design the board to distribute current among multiple positions and avoid concentrating current in one region, which would create hot spots. Measure actual contact resistance at the target operating current and temperature to verify the design does not exceed acceptable voltage drop or self-heating. If power delivery is the primary function, consider a dedicated power connector in parallel with the HCC22HETS rather than relying on all 22 positions for current.