ECC20DTMS-S189

FAQFrequently Asked Questions

• What are the key differences between the ECC20DTMS-S189 and single-edge card edge connectors, and when should I choose dual-edge for my PCB design? The ECC20DTMS-S189 is a dual-edge connector with 40 positions total (20 per edge), allowing simultaneous connections on both sides of a PCB. Single-edge connectors provide only one contact row. Dual-edge configurations like the ECC20DTMS-S189 are selected when your application requires increased signal density, parallel data paths on both PCB surfaces, or redundant interconnection channels. However, dual-edge designs demand precise PCB edge alignment and symmetrical gold plating on both edges, increasing manufacturing complexity and cost compared to single-edge alternatives.
• Can the ECC20DTMS-S189 handle my 5V logic and 12V power distribution signals simultaneously, or do I need separate connectors? The ECC20DTMS-S189 is a passive connector with no integrated voltage regulation or isolation. All 40 contact positions carry the same voltage potential relative to ground—there is no inherent separation between logic and power signals. You must design your PCB pinout to assign specific positions for5V logic, 12V power, and ground returns. The phosphor bronze contacts with gold plating rated to 30.0µin thickness provide adequate conductivity for mixed-voltage applications, but you assume responsibility for proper signal routing and ground plane continuity to prevent crosstalk and maintain signal integrity across the dual edges.
• What is the maximum current per contact on the ECC20DTMS-S189, and how does contact resistance affect power distribution designs? The ECC20DTMS-S189 datasheet does not specify individual contact current ratings. Current capacity depends on the contact's phosphor bronze material, gold finish thickness (30.0µin), and the loop bellows contact geometry, but these are not quantified in the published specifications. For power distribution, assume conservative current sharing across multiple contacts;do not route high currents through single contacts. Contact resistance increases with temperature over the -65°C to 125°C operating range, which can cause voltage drop in power rails. Test your specific PCB assembly and load profile to validate that contact resistance does not exceed acceptable thresholds for your 5V or 12V supplies.
• Is the ECC20DTMS-S189 suitable for hot-swap applications, or does repeated insertion and removal degrade the contacts? The ECC20DTMS-S189 contact type is loop bellows, which provides moderate mechanical durability but is not rated for extended hot-swap cycles. The loop design compresses on each insertion; repeated cycling causes stress-relaxation and loss of contact force over time. While the phosphor bronze material with gold plating resists corrosion, the connector is not designed for thousands of mating cycles. If your application requires frequent insertion and removal, consider connectors with higher cycle ratings (typically 50+ cycles for standard connectors, up to 500+ for industrial-grade edge connectors). For fixed installations, the ECC20DTMS-S189 offers adequate durability.
• How do I ensure the0.062" card thickness tolerance is met when designing a PCB for the ECC20DTMS-S189? The ECC20DTMS-S189 is specified for a card thickness of 0.062" (1.57mm). PCB thickness tolerance must be held within ±0.010" to ensure consistent contact pressure and alignment. If your PCB fabricator cannot maintain this tolerance, the connector contacts may not engage uniformly across all40 positions—some may be loose while others over-compress, leading to intermittent connections or accelerated wear. Specify0.062" ±0.010" explicitly in your PCB drawing and request thickness measurement coupons from your fabricator. Deviation beyond tolerance requires design re-evaluation or connector selection.
• Can I replace the ECC20DTMS-S189 with a DIN 41612 or other standard edge connector format, and what are the migration challenges? The ECC20DTMS-S189 uses a 0.100" (2.54mm) pitch layout specific to the Sullins ECC series. DIN 41612 connectors use a 2.0mm pitch and different contact geometries, making them physically incompatible without PCB redesign. Replacement with alternative dual-edge connectors (such as those from Hirose, Molex, or other manufacturers) requires: (1) new PCB edge profile and gold plating pattern, (2) re-layout of all signal and power traces, (3) potential changes to signal integrity characteristics due to different contact resistance and parasitic capacitance, and (4) re-validation of mechanical alignment and thermal cycling performance. Direct substitution is not possible; treat connector changes as a full design revision.
• The ECC20DTMS-S189 operating range is -65°C to 125°C—how does temperature affect contact resistance and signal integrity in my design? Contact resistance of the phosphor bronze loop bellows in the ECC20DTMS-S189 increases non-linearly with temperature, particularly above 100°C. At -65°C, contact resistance is lower but the PBT insulation material becomes more brittle, increasing risk of mechanical failure under vibration or thermal cycling stress. Over the full -65°C to 125°C range, signal propagation delay through the connector changes due to parasitic inductance and capacitance variations with temperature. If your application operates at temperature extremes (industrial, automotive, or aerospace), conduct thermal cycling testing (-65°C to 125°C, 5–10 cycles) on prototype assemblies to verify contact integrity, measure actual contact resistance changes, and confirm that signal rise times and voltage noise remain within specification.
• Does the ECC20DTMS-S189 meet the MSL 1 (Unlimited) moisture sensitivity requirement for my automotive or medical device assembly process? MSL (Moisture Sensitivity Level) 1 (Unlimited) means the ECC20DTMS-S189 connector does not degrade in moisture and requires no bake-out or special dry-box handling before soldering. This is advantageous for high-volume or distributed assembly where components may be stored for extended periods. However, MSL 1 applies only to the connector itself; your PCB substrate and other components may have higher MSL ratings that impose moisture control requirements on your entire assembly process. The PBT insulation material is hydroscopic at levels that do not affect connector function, but if your PCB remains in high-humidity environments post-assembly, verify that moisture ingress does not compromise solder joint reliability or insulation resistance between adjacent contact positions.
• What through-hole footprint and soldering profile are required for the ECC20DTMS-S189 right-angle mounting, and how do I avoid tombstoning or solder bridges? The ECC20DTMS-S189 uses through-hole right-angle mounting with solder termination. The connector's right-angle orientation places the PCB card-edge perpendicular to the main board, with solder tabs inserted into through-holes. Design your footprint with appropriate via placement to ensure solder flow to all 40 contact positions. Wave soldering is the typical process; ensure solder pot temperature is 250–260°C with adequatedwell time (3–5 seconds) to achieve full wetting on all contacts. Tombstoning does not typically occur with through-hole edge connectors, but solder bridges between adjacent contacts are possible if the solder wave is too aggressive or if flux residue blocks solder drainage. Use no-clean flux and inspect solder joints under magnification after wave soldering.
• How does the side-mount opening (0.125" diameter, unthreaded) on the ECC20DTMS-S189 affect mechanical mounting and PCB clearance design? The ECC20DTMS-S189 features side-mount openings with 0.125" (3.18mm) diameter holes, unthreaded. These openings allow mechanical alignment or optional locating pins butdo not support threaded fasteners. Your PCB must provide clearance around these openings; do not route traces or vias directly underneath. The unthreaded design means the connector relies on solder joint strength and contact friction for mechanical retention—over-torque or vibration can cause the connector to shift or lift partially off the PCB. For applications subject to vibration (automotive, industrial), consider adding mechanical standoffs or cable strain relief to reduce stress on solder joints and prevent contact separation.
• Is the ECC20DTMS-S189 RoHS3 compliant, and does this affect my supply chain or assembly process? The ECC20DTMS-S189 is RoHS3 compliant, which means it meets the Restriction of Hazardous Substances Directive (lead-free, cadmium-free, halogen-free where applicable). The gold contact finish at 30.0µin thickness is lead-free solder compatible. RoHS3 compliance does not change your soldering process if you already use lead-free solder, but it does restrict your material sourcing—you must ensure all other components and solder wire used with the ECC20DTMS-S189 also meet RoHS3 requirements. If you maintain a legacy mixed-material inventory, segregate ECC20DTMS-S189 connectors to prevent accidental use in non-RoHS3 products, which could create traceability or regulatory audit issues.
• The ECC20DTMS-S189 uses polybutylene terephthalate (PBT) insulation—how does this material perform in harsh chemical or UV-exposed environments? PBT is a thermoplastic engineering polymer with good chemical resistance to oils, solvents, and mild acids but can degrade under prolonged UV exposure or in environments with ozone. If your application involves outdoor mounting, direct sunlight, or exposure to industrial solvents or cleaning agents, the PBT insulation may become brittle or discolored over time, potentially affecting mechanical stability and insulation resistance. The connector's side-mount design provides some protection if the connector is recessed into an enclosure, but exposed installations require additional shielding or UV-stabilized conformal coating. Test a sample assembly in your specific environment (UV chamber, solvent tank, thermal cycling) for500–1000 hours to assess long-term PBT durability.
• What is the contact force specification for the ECC20DTMS-S189 loop bellows contacts, and how does this affect board-to-board connection reliability? The ECC20DTMS-S189 datasheet does not publish a specific contact force value (typically measured in grams or Newtons per contact). Loop bellows contacts generally provide moderate force (100–200g per contact is typical for this connector class), but without published data, you cannot verify contact force during design review. Low contact force increases risk of contact bounce or intermittent connections under vibration; excessive force causes accelerated wear and higher insertion force. Request contact force data from Sullins or conduct bench testing by measuring insertion force with a calibrated pull gauge. If the measured force is inadequate for your reliability requirements, specify a higher-force connector variant or ad mechanical retention features.
• Can I parallel multiple ECC20DTMS-S189 connectors for redundant signal paths or increased current capacity, and what are the synchronization risks? Paralleling multiple ECC20DTMS-S189 connectors for redundancy or higher current capacity is mechanically possible but introduces synchronization challenges. Since each connector engages independently during insertion, slight differences in contact force and timing can cause one connector to engage before others, creating transient signal imbalances or current surges. For parallel high-current applications, use a dedicated backplane bus with consistent trace impedance and multiple connector positions for current distribution, rather than separate parallel connectors. For redundancy, implement active switching logic to detect connector disconnection and failover to a backup path; passive parallel does not guarantee balanced current sharing or failover behavior.
• The ECC20DTMS-S189 has a gold finish thickness of only 30.0µin—is this sufficient for corosion resistance and fretting corosion in salt-spray or humid industrial environments? A gold finish thickness of 30.0µin (0.76µm) is a standard electroplated layer that provides corosion protection under normal storage and operating conditions but is not rated for harsh salt-spray (ASTM B117) or extended marine environments. Salt-spray testing typically requires gold thickness ≥50µin for multi-thousand-hour survival. If your application is deployed in coastal, marine, or salt-fog industrial environments, the ECC20DTMS-S189 may experience fretting corrosion and contact resistance increase over 1–3 years of operation. Consider connectors with thicker gold plating (50–100µin) or specify a protective conformal coating over the connector assembly and edges of the PCB to reduce moisture and salt ingress.
• How do I validate signal integrity and crosstalk between the dual edges of the ECC20DTMS-S189 in high-speed digital applications? The ECC20DTMS-S189 datasheet provides no AC electrical specifications (insertion loss, return loss, crosstalk coupling). For high-speed applications (>100 MHz differential signals or >1Gbps serial data), treat the connector as an unknown transmission line and conduct board-level signal integrity analysis using time-domain reflectometry (TDR) and electromagnetic simulation. Measure crosstalk between adjacent contacts by coupling a fast digital signal onto one contact while monitoring neighboring contacts under operating load. The dual-edge geometry means signal coupling between the two edges is possible, particularly if ground return paths are not distributed uniformly. Prototype and test your specific signal assignment before full production to confirm bit error rates (BER) and eye diagrams meet target margins.
• Is the ECC20DTMS-S189 compatible with automated pick-and-place assembly, or must it be hand-inserted and soldered? The ECC20DTMS-S189 is a through-hole connector designed for wave soldering or manual insertion + wave soldering; it is not suited for surface-mount pick-and-place equipment. The connector's right-angle mounting and solder tab geometry require manual placement on the PCB before wave soldering. If you transition to automated assembly, you cannot use standard SMD pick-and-place for this connector. Some contract manufacturers offer selective soldering or robotic wave soldering that can handle mixed through-hole and SMD boards, but costs are higher than full SMD production. For high-volume or cost-sensitive applications, consider surface-mount alternatives from Sullins or other suppliers that are pick-and-place compatible.
• The ECC20DTMS-S189 is listed as ECCN EAR99—does this affect export compliance or customs clearance for my product? ECCN EAR99 means the ECC20DTMS-S189 connector is classified under Export Administration Regulations (EAR) as a standard commercial item with minimal export restrictions. EAR99 does not require individual export licenses for most destinations, simplifying your supply chain and product distribution. However, ECCN classification does not grant universal export rights; some countries (embargoed nations, sanctioned entities) may still restrict imports regardless of ECCN status. Verify your specific end-customer location and use with your compliance or legal team before exporting products containing the ECC20DTMS-S189. ITAR (International Traffic in Arms Regulations) does not apply to this connector.
• What storage conditions and shelf life are recommended for the ECC20DTMS-S189 before assembly, given its MSL 1 rating and PBT insulation? MSL 1 (Unlimited) allows the ECC20DTMS-S189 to be stored without bake-out or dry-box conditioning; standard room temperature and humidity warehousing is acceptable. However, PBT insulation can absorb moisture over extended storage (>2 years) in high-humidity environments (>75% RH), potentially affecting dielectric strength. Recommended storage: sealed bag or tray packaging, 15–35°C, ≤75% RH, away from direct sunlight. Do not expose the connector to solvents or high temperatures during storage. The gold finish may tarnish if exposed to sulfur-containing environments (industrial areas, volcanic regions), but does not degrade functionally. Follow your supplier's recommended shelf life (typically 5–10 years if conditions are maintained).
• When migrating from a legacy single-edge edge connector to the ECC20DTMS-S189 dual-edge design, what are the electrical and mechanical validation steps required? Migrating to the ECC20DTMS-S189 requires comprehensive re-validation: (1) Mechanical—verify PCB edge profile tolerance (±0.010"), gold plating thickness and surface coverage on both edges, and contact alignment under insertion force. (2) Electrical—measure contact resistance on all40 positions across the full -65°C to 125°C temperature range; confirm insertion loss and crosstalk on high-speed signal pairs; validate ground return continuity between the two edges. (3) Thermal—conduct thermal cycling (-65°C to 125°C, minimum 5 cycles) on prototype assemblies and measure contact resistance before and after to detect degradation. (4) Mechanical cycling—if applicable to your application, perform insertion/withdrawal cycling (minimum 5 cycles) and re-measure contact resistance to establish baseline wear. (5) System integration—test the full product in your actual operating environment (vibration, humidity, temperature) to confirm performance parity with the legacy design or identify new failure modes specific to the dual-edge configuration.