2007738-1

FAQFrequently Asked Questions

• What are the key design considerations when integrating the TE Connectivity 2007738-1 180-position Impact receptacle into a high-density backplane application? The 2007738-1 is a board-edge, right-angle receptacle with an 18×10 position matrix and 0.75A per-contact current rating. When designing the backplane, ensure your PCB edge thickness matches the connector's retention specifications, and verify that the through-hole press-fit termination footprint accommodates standard 0.062-inch or 0.093-inch board thickness. The 30V voltage rating sets the maximum differential voltage between adjacent signal layers; in mixed-signal designs, separate analog and digital planes accordingly. The right-angle mounting means the mating plug extends perpendicular to the PCB, so account for clearance in your chassis design and allow sufficient space for insertion and removal without mechanical interference.
• Can the TE Connectivity 2007738-1 be used in applications requiring continuous 0.75A current draw across all 180 positions simultaneously? The 2007738-1 is rated for 0.75A maximum per individual contact. In practice, simultaneous full-current draw across all 180 positions would generate significant heat and voltage drop. Calculate the actual current distribution based on your application; if multiple high-current signals are necessary, verify that total backplane current does not exceed the connector's thermal dissipation capability. For continuous operation at -55°C to 85°C, model the voltage drop across the press-fit contact resistance (typically 20–40 mΩ per contact) to ensure downstream circuits tolerate the resulting IR loss. If your design requires higher current density, consider splitting loads across multiple 2007738-1 connectors or selecting a lower-resistance connector family.
• How does the press-fit termination of the 2007738-1 Impact receptacle compare to solder-cup or crimp-contact alternatives in terms of assembly yield and long-term reliability? Press-fit termination in the 2007738-1 eliminates soldering process variability and cold-joint risks inherent in wave or reflow soldering. During assembly, press-fit contacts are inserted under controlled force, creating a permanent mechanical interlock with the PCB copper. This method typically achieves first-pass assembly yields above 99% when tooling and hole tolerances are correct. Long-term reliability depends on maintaining proper hole sizing (typically H7 tolerance or tighter); oversized or worn holes can reduce contact retention force. The press-fit design is less prone to thermal cycling fatigue than solder joints, making it preferable for industrial environments with -55°C to 85°C temperature swings. Crimp contacts require additional labor and tooling but offer field reworkability; solder-cup contacts are faster but demand process control and rework capability.
• What is the minimum PCB thickness and copper weight required for reliable press-fit performance of the 2007738-1? The 2007738-1 press-fit contacts are designed for standard FR-4 PCBs with thickness between 0.062 and 0.093 inches. For reliable retention, the copper weight should be minimum 1 oz (35 µm) per layer; thicker copper (2 oz or higher) reduces insertion force variability and improves repeatability across production runs. Press-fit retention relies on elastic deformation of the PCB material around the contact barrel. Thinner or softer materials (such as flexible PCB or polyimide) will not provide adequate retention and may result in contact loosening after thermal cycling. Verify your PCB manufacturer's hole finish and plating specifications; rough or overplated holes increase insertion force and risk contact damage.
• Is the TE Connectivity 2007738-1 suitable for replacing legacy 96-pin or 120-pin backplane connectors in retrofit or migration scenarios? The 2007738-1 offers 180 positions, which exceeds most legacy 96-pin and 120-pin connectors, so pin count is not a limiting factor for upgrade applications. However, legacy connectors often have different pitch, row/column configurations, voltage ratings, or current handling. Verify that the 30V rating, 0.75A per-contact limit, and right-angle geometry match your retrofit requirements. If the original design used press-fit connectors, the 2007738-1 is a direct fit; if the original used crimp or solder-cup contacts, you must redesign the backplane footprint and retooling costs may outweigh benefits. Check the mechanical envelope (board edge mounting style and connector body dimensions) against your chassis constraints. Legacy connectors sometimes operated at higher voltage or current; ensure your replacement design does not exceed 2007738-1 limits.
• How does the gold contact finish (30 µin thickness) on the 2007738-1 perform in corrosive or humid industrial environments? The 30 µin (0.76 µm) gold finish on the 2007738-1 provides corrosion resistance and low contact resistance in harsh conditions. This thickness is sufficient to prevent base metal migration and oxidation during the operating life at -55°C to 85°C. However, 30 µin gold is a minimum specification; thicker plating (50+ µin) offers extended durability in salt-fog or chemical environments. In outdoor or marine applications, the UL94 V-0 black plastic housing will resist UV and thermal degradation better than unfilled compounds, but prolonged exposure to chlorine, sulfur dioxide, or ozone can still degrade both contacts and housing. If your application involves periodic moisture ingress, specify conformal coating over the connector area or select a sealed connector variant. Annual inspection of mated connectors is recommended in corrosive environments to detect contact oxidation or fretting.
• Can the TE Connectivity 2007738-1 be intermated with TE Impact series plugs from different product lines or generations? The 2007738-1 receptacle is part of TE's Impact connector family and is designed to mate with TE Impact plugs that share the same 18×10 position matrix and board-edge style. However, not all TE Impact plugs are compatible. Cross-reference the mating plug part number against TE's compatibility matrix to confirm pin assignment, contact type, and mechanical alignment. Older Impact generations may have slightly different contact geometry, gold thickness, or retention force specifications. Attempting to force an incompatible plug will damage contacts and degrade mating surfaces. If upgrading from a legacy TE Impact variant, test a sample mated pair under your operating conditions before committing to production. Some Impact plugs are designed for right-angle board mounting, while others are straight-through; verify the mounting style matches your backplane layout.
• What insertion and mating force specifications should be validated during design validation for the TE Connectivity 2007738-1? TE specifications for the 2007738-1 typically define insertion force per contact and total mating force for the full 180-position connector. Measure insertion force to detect worn holes or tooling drift during production. Excessive force (above specification limits) indicates undersized holes or contamination; insufficient force suggests oversized holes or damaged contacts. During design validation, mate and unmate the connector 50–100 times across the full temperature range (-55°C to 85°C) to confirm contact retention and electrical continuity. Document contact resistance before and after thermal cycling; an increase above 100 mΩ per contact indicates fretting or corrosion. Perform pull-test measurements on individual contacts to confirm retention force meets specification; this is particularly critical in vibration-prone applications.
• How should the TE Connectivity 2007738-1 be handled and stored to prevent contact damage before assembly? The 2007738-1 should be stored in anti-static bags or trays to prevent ESD damage to the plastic housing and contact plating. Moisture sensitivity level (MSL) 1 indicates unlimited moisture exposure without baking requirements, so standard dry-box storage is adequate. Handle the connector by the plastic body only; avoid touching the contact area. Inspect contacts visually for bent tines, oxidation, or debris before assembly. If storage exceeds one year, verify contact shine with a magnifying glass; dull or discolored contacts suggest oxidation and should be cleaned or replaced. Do not stack connectors without protective spacers, as weight compression can deform contacts. If connectors are exposed to high humidity or temperature fluctuations during transport, allow them to acclimate to room conditions before opening packaging.
• What are the electrical isolation and crosstalk considerations when routing signals through all 180 positions of the TE Connectivity 2007738-1 in a mixed-signal backplane? The 2007738-1's 18×10 position matrix means signals are closely spaced; crosstalk between adjacent signal rows is a primary concern in high-frequency applications. Layer the backplane with power and ground planes immediately adjacent to the connector mounting surface to minimize loop inductance and provide return paths. For high-speed differential pairs, keep signal separation and routing as uniform as possible to avoid impedance mismatch. The 30V voltage rating applies across the full connector; do not place analog low-signal traces adjacent to high-current digital switching lines, as this increases noise coupling. Use guard traces or ground stitching around sensitive analog regions. The press-fit through-hole termination provides low contact resistance but higher inductance than surface-mount alternatives; if your design requires sub-nanosecond timing, model the connector's delay contribution using TE's electrical models or supplier simulation data.
• In a high-vibration or aerospace application, how does the TE Connectivity 2007738-1 press-fit design compare to crimped or locked-pin connectors for contact retention? The 2007738-1 press-fit design relies on mechanical friction between the contact barrel and PCB copper to maintain connection. Under sustained high vibration, fretting can occur at the contact interface, gradually degrading conductivity and increasing contact resistance. For aerospace or military-grade applications per MIL-DTL-38999 or DO-160G, locked-pin or crimped-contact connectors with mechanical locking features may provide superior vibration immunity. Test the 2007738-1 to IEC 60068-2-6 (vibration testing) across your frequency range to confirm no intermittent opens or resistance changes. If the application requires continuous operation in resonant environments, supplement the connector with cable clamps or strain relief to reduce vibration transmission to the connector itself. Alternatively, consider TE's sealed or shielded Impact variants if environmental vibration or EMI is severe.
• What are the thermal management and derating considerations for the TE Connectivity 2007738-1 when operating continuously at elevated temperatures near 85°C? The 2007738-1 is rated to 85°C maximum operating temperature, but continuous operation at this limit accelerates plastic creep in the housing and reduces contact wiping force over time. The 0.75A per-contact rating assumes ambient conditions; at 85°C, derating factors typically reduce this by 10–20% depending on thermal conductivity and PCB layout. Calculate total connector power dissipation as I²R (current squared times contact resistance); a fully loaded 180-position connector at 0.5A average per contact dissipates roughly 0.9–1.8W depending on contact resistance. Ensure PCB thermal vias beneath the connector provide adequate heat sinking to ambient or internal heatsinks. If your backplane cannot maintain junction temperature below 75°C during continuous operation, reduce per-contact current or select a lower-current-density design. Monitor connector housing temperature with an infrared thermometer during thermal validation; plastic deformation becomes visible above 80°C sustained use.
• Are there RoHS and REACH compliance implications when specifying the TE Connectivity 2007738-1 for European or Asian markets? The 2007738-1 is RoHS3 compliant, confirming that lead, cadmium, mercury, and other restricted substances are absent or below threshold limits. REACH status is listed as 'Vendor Undefined,' meaning TE has not disclosed full SVHC (Substances of Very High Concern) data for this connector. Before committing to large production volumes for EU customers, request a REACH declaration from TE; this may require Annex XIV authorization or SVHC notification depending on substance content. The gold plating and UL94 V-0 plastic are generally REACH-compliant, but specific batch certifications are necessary for regulated industries (medical, automotive). If your end market includes China RoHS or India RoHS compliance, verify the 2007738-1 meets those regional standards, which may differ from EU RoHS3. Document all compliance certifications in your design history for audit trail.
• How does the right-angle mounting style of the TE Connectivity 2007738-1 affect backplane layout, connector height budget, and insertion/removal accessibility? The 2007738-1's right-angle board-edge mounting means the mating connector extends perpendicular to the backplane, typically adding 0.5–1.0 inch to the overall depth of the assembly depending on the mating plug type. This style is ideal for compact systems where plug insertion is perpendicular to the main PCB surface. Account for this clearance in your chassis design and ensure no mechanical interference with cooling ducts, component stacking, or neighboring backplanes. Insertion and removal typically require straight-line motion without angled approaches; verify that your assembly floor equipment or manual procedures can accommodate this requirement. If space is severely constrained, evaluate straight-through edge-mount or right-angle vertical connector alternatives, but these may require redesigned footprints.
• What failure modes should be included in a failure modes and effects analysis (FMEA) for the TE Connectivity 2007738-1 in a mission-critical backplane application? Primary failure modes for the 2007738-1 include contact intermittency (fretting, oxidation, or mechanical looseness), short circuits (contact protrusion or foreign material), and open circuits (contact corrosion or mechanical separation). Secondary failure modes involve plastic housing cracking under thermal cycling stress, leading to moisture ingress and corrosion. Tertiary modes include manufacturing defects such as contact misalignment, missing or damaged tines, or press-fit voids in the PCB copper. For mission-critical applications, perform accelerated life testing (ALT) including thermal cycling per IEC 60068-2-14, thermal shock, humidity-and-bias testing per IEC 60068-2-30, and contact resistance trending over 1,000+ mating cycles. Model the probability of latent defects propagating through assembly and early field operation; TE's published defect rates (typically <50 ppm for qualified connectors) should be cross-checked against your assembly process capability and incoming inspection data.
• Can the TE Connectivity 2007738-1 be reworked or field-replaced without damaging the backplane PCB if a contact or connector section fails? The press-fit design of the 2007738-1 makes field removal and replacement more difficult than crimp contacts. Extracting a failed 2007738-1 from a PCB typically requires specialized desoldering equipment or mechanical removal tools to avoid tearing copper traces or plating from the hole. Once removed, the original holes may be damaged, enlarged, or have ragged copper edges, making re-insertion of a replacement connector problematic. If field rework is critical, design spare connector footprints on the backplane during initial layout, or select a design that allows partial connector removal (e.g., modular row-by-row replacement). For permanent installations, accept the connector as non-field-replaceable and plan for full backplane replacement on failure. Document the expected mean time to failure (MTTF) and establish spare inventory accordingly. If reworkability is essential, consider alternative connectors with better field-serviceability or design in redundant signal paths.
• What cable or connector type is typically mated to the TE Connectivity 2007738-1 receptacle, and are there compatibility issues with third-party Impact family plugs? The 2007738-1 receptacle mates with TE Impact series plugs designed for 180-position, 18×10 configurations. Plugs may be right-angle board-mount or cable-integrated depending on the application. TE manufactures several plug variants (e.g., 2007740, 2007741) with similar contact geometry but different housing styles or mounting. Third-party Impact-compatible plugs from non-TE suppliers are rare; most backplane systems use TE plugs exclusively to ensure contact compatibility and mating force specifications. If you encounter a requirement to use non-TE plugs, request dimensional drawings and contact geometry data from the third-party supplier and validate mating forces experimentally before design release. Mismatch in contact tine geometry, retention force, or gold thickness can result in high insertion forces, contact damage, or intermittent connections. Stick with TE plug variants unless you have field-proven compatibility data.
• In a system with multiple TE Connectivity 2007738-1 connectors stacked or arranged in close proximity, what EMI shielding or isolation measures should be considered? Multiple 2007738-1 connectors arranged side-by-side or stacked increase EMI coupling between connectors due to proximity of signal traces and shared return paths. If connectors are within 1–2 inches of each other, implement Faraday shielding using grounded compartments or shield cans around each connector zone. Ensure all shield connections are bonded to a solid ground plane or chassis ground through multiple vias to avoid floating shield potential. Separate analog and digital signal connectors spatially; if mixed signals must use the same connector area, dedicate rows within the 2007738-1 matrix to each signal family and maintain consistent routing to avoid cross-talk. Use differential signaling for high-speed traces and keep differential pairs tightly coupled. If high-frequency content (>100 MHz) is present, model the connector's parasitic capacitance and inductance to predict signal attenuation and group delay across the connector matrix.
• How should test points or in-circuit test (ICT) access be designed when using the TE Connectivity 2007738-1 in a dense backplane to enable manufacturing and field diagnostics? The 2007738-1's 180-position density leaves limited space for probe access on the backplane surface. Design ICT test points on the back of the PCB or use bed-of-nails fixtures that contact the mated connector pins from the rear. Alternatively, include spare connector positions within the 2007738-1 matrix dedicated to boundary-scan test (BIST) signal routing, allowing daisy-chained test access to high-pin-count ICs. If full backplane testing is required, evaluate flying-probe testing or functional boundary-scan methods that do not require contact with individual traces. Document all test-point locations and pin assignments in your manufacturing instructions. Ensure test fixture design accounts for the right-angle connector geometry; probe needles or pogo pins must approach the connector perpendicularly without mechanical interference.
• What are the cost and lead-time implications of sourcing TE Connectivity 2007738-1 connectors in high volume, and are there approved alternative suppliers or distributor options? The 2007738-1 is a standard TE Connectivity catalog part with broad distributor availability through major electronics distributors (Arrow, Heilind, ScanSource, etc.). Lead times typically range from 4–12 weeks depending on market demand and TE production capacity. For high-volume programs (10,000+ units annually), negotiate direct supply agreements with TE or authorized distributors to secure competitive pricing and prioritized allocation. The 2007738-1 has no direct cross-vendor equivalents; equivalent functionality requires switching to non-TE connector families, which necessitates backplane redesign and qualification. If supply chain risk is a concern, establish a multi-source design using a second TE Impact variant with similar electrical and mechanical specifications, or design in redundant connectors that can be swapped if one supplier encounters allocation issues. Document all approved part numbers and supplier names in your design control documentation for audit compliance.