Targeting the advanced packaging market, Intel partners with Amkor Korea to deploy EMIB production capacity

Recent reports from Korean media indicate that Intel has established production lines for its advanced packaging technology “EMIB” within Amkor's K5 factory in Songdo, South Korea.

EMIB is a 2.5D packaging technology used to connect different semiconductor dies. In AI chips, this technology enables high-bandwidth memory (HBM) to be configured around the graphics processing unit (GPU). Signals are transmitted via silicon bridges embedded within the semiconductor substrate, termed “EMIB.” Compared to silicon interposers commonly used by competitors, EMIB offers advantages in cost efficiency and manufacturing productivity. By utilizing silicon bridges, EMIB is recognized for its superior pricing and manufacturability while enabling precise 2.5D packaging.

Intel plans to mass-produce its next-generation EMIB technology—EMIB-T—by 2026. EMIB-T incorporates advanced Through-Silicon Vias (TSVs) onto the silicon bridges. TSVs provide vertical signal pathways, significantly enhancing the speed and overall performance of the final product. Given Intel's comprehensive EMIB collaboration with Amkor Technology, industry observers widely anticipate that the two companies will likely extend their partnership to EMIB-T technology, further broadening their cooperative scope.

Industry sources note that Intel historically confined EMIB packaging for high-performance semiconductors to its own facilities in locations like the United States and Malaysia. This shift toward outsourcing the technology primarily aims to address growing market demand by expanding its global supply chain. It is reported that Intel and Ankor signed an EMIB technology partnership as early as April 2025, ultimately selecting Songdo K5 as the facility to implement the collaboration.

Ankor currently operates packaging plants globally, including in the United States, South Korea, and Singapore. Among these, the Songdo K5 facility in South Korea possesses highly advanced equipment, enabling it to package semiconductors for major North American technology companies—a key factor in Intel's selection.

Additionally, Songdo's excellence in packaging infrastructure—including materials, components, equipment, and workforce—played a significant role in Intel's decision. Industry observers anticipate this collaboration will not only generate economic and industrial benefits for the Songdo region but also enhance South Korea's strategic position within the global semiconductor supply chain.