TSMC to Develop Glass Substrates for NVIDIA, First Chips Expected by 2025

Glass substrates have become a hot topic in the semiconductor market, with a new report indicating that TSMC and Intel are actively ramping up their research and development efforts, and NVIDIA is prioritizing this technology for its future chips.

As the artificial intelligence (AI) market rapidly expands, the demand for innovative technologies has surged, particularly to maintain generational performance upgrades. Companies like NVIDIA have already leveraged advancements in architecture, but modern hardware, especially accelerators, consists of numerous components, with packaging technology being critical. The industry views glass substrates as a way forward from traditional CoWoS packaging.

A report suggests that TSMC, Intel, Samsung Electronics, and others are heavily investing in the development of glass substrate technology to achieve breakthroughs, though the technology is still in its infancy and has a long way to go. Interestingly, Intel leads the way, having announced its glass substrate plans over a decade ago and reportedly reaching mass production capability, putting it ahead of all other competitors.

Moreover, TSMC is reportedly developing glass substrates for NVIDIA’s future FOPLP (Fan-Out Panel-Level Packaging) based on NVIDIA’s specific needs. This technology will primarily use glass substrates and is expected to bring numerous benefits, particularly in increasing chip size and transistor density per unit area. Given TSMC’s expertise in this specific area, Intel’s "timing advantage" is not expected to significantly impact TSMC, as the latter has earned the trust of major customers in the market.

The report also mentions that many Taiwanese manufacturers view glass substrates as a "future investment." TSMC, along with its long-time collaborator Unimicron, has initiated the formation of the E-core System Alliance, gathering relevant supply chain players to establish a glass substrate supply network, aiming to capture orders from Intel, TSMC, and others. As the AI boom enters its next phase, it is clear that glass substrates will play a significant role in the future. Previous reports have indicated that major manufacturers are targeting a 2025-2026 window for these solutions to hit the market, with Intel and TSMC leading the charge.