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SEMI: Global 200nm fab capacity will increase by 17% from 2020 to 2024, reaching 6.6 million wafers per month
According to SEMI China, the latest report released by SEMI shows that global semiconductor manufacturers are expected to increase the capacity of 200mm wafer fabs by 17% from 2020 to 2024, reaching a record high of 6.6 million wafers per month.
Ajit Manocha, President and CEO of SEMI, said: “The 200mm Fab Outlook Report shows that during the same period, wafer manufacturers will add 22 new 200mm fab fabs to help meet the continuous demand for 5G, automotive and Internet of Things (IoT) equipment. Increasing demand, these rely on the integration of IC, MOSFET, microcontroller unit (MCU) and sensor simulation, power management and display drivers."
The report shows that foundry will account for more than 50% of global fab production capacity this year, followed by simulation with 17%, and discrete/power at 10%. In 2021, China's mainland will take the lead in the world with a 200mm production capacity, and its market share will reach 18%, followed by Japan and China's Taiwan region, each reaching 16%.
In addition, the report pointed out that the global 200nm fab equipment expenditure will exceed the US$3 billion mark in 2020 and is expected to reach nearly US$4 billion in 2021.
The report shows that foundry will account for more than 50% of global fab production capacity this year, followed by simulation with 17%, and discrete/power at 10%. In 2021, China's mainland will take the lead in the world with a 200mm production capacity, and its market share will reach 18%, followed by Japan and China's Taiwan region, each reaching 16%.
In addition, the report pointed out that the global 200nm fab equipment expenditure will exceed the US$3 billion mark in 2020 and is expected to reach nearly US$4 billion in 2021.