Intel Reportedly Increases Purchase of ASML High-NA EUV Equipment

According to TechNews, Intel has recently increased its order for High-NA EUV (extreme ultraviolet lithography) equipment from Dutch manufacturer ASML from one to two units, underscoring its high priority on the 14A process.

As semiconductor processes advance toward more advanced nodes, traditional EUV lithography technology is nearing its physical limits. High-NA EUV is regarded as the key equipment to break through this bottleneck. ASML's High-NA EUV equipment has limited production capacity, with annual output of approximately five to six units. Each machine costs around $370 to $380 million (approximately RMB 2.6 to 2.7 billion), making it affordable only to a handful of financially robust chipmakers like TSMC, Samsung, SK Hynix, and Intel.

Intel is actively expanding its investments, partly bolstered by recent external funding. For instance, Intel secured $5 billion from NVIDIA in 2025 and $2 billion from SoftBank. These funds have significantly enhanced Intel's cash flow and capital expenditure capacity, enabling it to secure early access to ASML's initial High-NA EUV production capacity.

Intel's strategic focus is on its 14A process (1.4-nanometer node), aiming to leverage High-NA EUV technology to improve process precision and yield rates, thereby attracting more foundry clients. However, company executives have explicitly stated that if the 14A process fails to gain market acceptance, Intel will be forced to withdraw from the high-end process node competition, which would significantly impact its Intel Foundry Services (IFS) business.

Although a second High-NA EUV system has been procured, uncertainties remain regarding its ability to fully overcome process bottlenecks. Success hinges on factors including yield management, design tool maturity, and comprehensive supply chain coordination capabilities. Intel senior engineer Steve Carson revealed that the company is now producing approximately 30,000 wafers per quarter using its first two High-NA EUV systems. Each silicon wafer can yield thousands of chips, indicating a notable improvement in equipment stability.