According to TechPowerUp, ASML recently stated that based on current order information and demand, it expects to deliver 10 High-NA EUV and 56 EUV lithography systems by 2027. Notably, both Intel and Samsung have recently increased their lithography system orders. Intel raised its High-NA EUV order from 1 to 2 systems and its EUV order from 3 to 5 systems. Samsung also increased its EUV order from 5 to 7 systems.
Notably, SK Hynix accounts for 20 of the EUV systems ASML will deliver by 2027, while also increasing its High-NA EUV order from one to two units. Furthermore, SK Hynix is rumored to plan installing 20 EUV systems within the next two years, all procured for HBM and advanced memory solutions.
While Intel is likely to be the first semiconductor manufacturer to introduce High-NA EUV exposure technology into mass production, Samsung and SK Hynix are rapidly catching up. Particularly for SK Hynix, at its current pace of capacity expansion, additional fab space will be required to accommodate the installation of these lithography systems.